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Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

机译：使用应变计测量焊料回流过程中印刷电路板的热致曲率和翘曲

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Meng-Chieh Liao; Pu-Shan Huang; Yi-Hsien Lin; Ming-Yi Tsai; Chen-Yu Huang; Te-Chin Huang;
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1. Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges ? [J] . Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Applied Sciences . 2017,第7期

机译：使用应变仪在焊料回流过程中的热致曲率和印刷电路板翘曲的测量？
2. Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges ? [J] . Meng-Chieh Liao, Pu-Shan Huang, Yi-Hsien Lin, Applied Sciences . 2017,第7期

机译：使用应变仪在焊料回流过程中的热致曲率和印刷电路板翘曲的测量？
3. Applying strain gauges to measuring thermal warpage of printed circuit boards [J] . Huang Chien-Yi, Ying Kuo-Ching Measurement . 2017,第期

机译：将应变仪应用于测量印刷电路板的热翘曲
4. Warpage measurements of printed circuit board during reflow process using strain gauges [C] . Liao M.C., Huang P.S., Lin Y.H., 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, 16th International Conference on Electronic Materials and packaging . 2014

机译：使用应变仪在回流过程中测量印刷电路板的翘曲
5. Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage. [D] . Tan, Wei. 2008

机译：对流回流投影云纹翘曲测量系统的开发，以及受翘曲影响的电路板组件上焊料凸点可靠性的预测。
6. Novel waste printed circuit board recycling process with molten salt [O] . Frank Riedewald, Maria Sousa-Gallagher 2015

机译：熔融盐回收废电路板的新工艺
7. A process model of the infra-red reflow soldering of printed circuit board assemblies [O] . Whalley David C., Ogunjimi Adebayo Oluyinka, Conway Paul P., 1991

机译：印刷电路板组件的红外回流焊工艺模型
8. Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance;Circuit World [R] . Vianco, P. T. 1998

机译：表面处理概述及其在印刷电路板可焊性和焊点性能中的作用;电路世界

Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges

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